中圖分類號：TN406 文獻標志碼：A DOI: 10.16157/j.issn.0258-7998.234255
中文引用格式： 王輅，柏晗，曾燕萍，等. 金屬封裝微系統(tǒng)內(nèi)部高壓擊穿和爬電問題的點云分析方法[J]. 電子技術(shù)應(yīng)用，2024，50(2)：38-42.
英文引用格式： Wang Lu，Bai Han，Zeng Yanping，et al. A point cloud analysis method for high-voltage breakdown and creepage inside metal-encapsulated system-in-package[J]. Application of Electronic Technique，2024，50(2)：38-42.

A point cloud analysis method for high-voltage breakdown and creepage inside metal-encapsulated system-in-package

Abstract： This paper combines high-precision modeling and graph theory ideas to establish a novel reliability analysis method, which provides a strong guarantee for product design and testing, for analyzing the potential risk of breakdown and creepage inside the high-voltage isolated system-in-package products. Firstly, the 3D model of the product is converted into a point cloud model, and a computable numerical model is formed through filtering and surface reconstruction. Then, according to the geometric characteristics and physical relations, the surface creepage problem and breakdown problem are equivalent to the calculation of geodesic path and Euclidean path, respectively. According to the layout, the Dijkstra algorithm is optimized to calculate the breakdown and creepage paths after packaging. Finally, the product risk level is judged by reference to the experimental standards.

Key words : system-in-package；point cloud analysis；Dijkstra algorithm；high-voltage breakdown；high-voltage creepage